JPH0119402Y2 - - Google Patents
Info
- Publication number
- JPH0119402Y2 JPH0119402Y2 JP11679084U JP11679084U JPH0119402Y2 JP H0119402 Y2 JPH0119402 Y2 JP H0119402Y2 JP 11679084 U JP11679084 U JP 11679084U JP 11679084 U JP11679084 U JP 11679084U JP H0119402 Y2 JPH0119402 Y2 JP H0119402Y2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- holding
- lead frame
- package
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 14
- 229910052799 carbon Inorganic materials 0.000 description 14
- 239000000758 substrate Substances 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 229910000833 kovar Inorganic materials 0.000 description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11679084U JPS6133437U (ja) | 1984-07-30 | 1984-07-30 | 小型セラミツクパツケ−ジ用ろう付治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11679084U JPS6133437U (ja) | 1984-07-30 | 1984-07-30 | 小型セラミツクパツケ−ジ用ろう付治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6133437U JPS6133437U (ja) | 1986-02-28 |
| JPH0119402Y2 true JPH0119402Y2 (en]) | 1989-06-05 |
Family
ID=30675719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11679084U Granted JPS6133437U (ja) | 1984-07-30 | 1984-07-30 | 小型セラミツクパツケ−ジ用ろう付治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6133437U (en]) |
-
1984
- 1984-07-30 JP JP11679084U patent/JPS6133437U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6133437U (ja) | 1986-02-28 |
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